Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.
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All testing occurs inside the chamber, while the cards are exposed to the test humidity. A UNIT of desiccant is de? Socketed components should be removed prior to rework. When this option is used, it must be veri?
Spots without printing shall be tested. Printing in the indicating spot colored area will affect hue measurement. Jj-std-033b.1 Considerations for Baking Tables, and give reference conditions for drying SMD packages. This table is applicable to SMDs molded with novolac, biphenyl, or multifunctional epoxy mold compounds.
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The bake times speci? Storage of SMD packages in a dry cabinet should be jecec to a maximum time per Table Impose following two exposure conditions: Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life see Clause 5.
If bake is interrupted for greater than 15 minutes the total time of the interruption should be added to the bake time.
Table may be used as a guide in identifying an appropriate bake cycle. If the bag is to be resealed refer to Clause 4. This can be determined by weighing a representative quantity of material known to be at equilibrium with the manufacturing environment, baking to a new constant weight, and subtracting the?
Special consideration should be given to non-hermetic cavity packages. This method will minimize moisture related component damage.
jedc Humidity conditions can be achieved by placing combinations of molecular sieve desiccant, glycerin, and water inside the chamber. For components exposed anytime less than their stated? Such processes are not allowed for many SMDs and are not covered by the component quali? Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. Also the actual bake time may be reduced if technically justi?
Although unanticipated, factors other than moisture sensitivity could affect the total shelf life of components. Testing Procedure Place the sealed container of cards into the chamber. Users may reduce the actual bake time if technically justi? Cards with spots that do not indicate dry or wet conditions, per Tableshould be rejected.
J-STD Bake Conditions
Therefore, the effect of these materials must be compensated for by baking or, if required, adding additional desiccant in the MBB to ensure the shelf life of the SMD packages. This may present an additional risk, which should j-std-03b3.1 evaluated.
It is intended to make the HIC test method and criteria a separate standard in the future. As a minimum, all materials used in dry packing should conform to EIA If the time limit is exceeded the packages should be baked according to Table to restore the? The following conditions ipv regardless of the storage time i.
If jede component on the board has exceeded its? Open the container and suspend two cards inside the chamber so that the spots can be observed from outside the chamber. Peak package body temperature: All comments will be collected and dispersed to the appropriate committee s.
The percentage of change in hue from one humidity value to another is then calculated. The spots shall indicate the humidity with j-srd-033b.1 signi?
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A dry cabinet should not be considered a MBB. Table summarizes conditions for resetting or pausing the? Maurice Brodeur, Analog Devices Inc. Any SMD package that has not exceeded its? This document describes the standardized levels of?
After bake, must be re? It does not apply to bulk solder re? If a higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers.