JIS Z Test methods for flat pallets (FOREIGN STANDARD). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. Standard (JIS Z ) was performed. From the obtained results, the possibility of practical application was exam- ined. Moreover, the manufacturing process of. JIS Z – JIS Z Test methods for flat pallets. Publication date: ; Original language: English. Please select.
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In chemical reactions, if molecules reach the temperature above which they may react the activation energya reaction occurs. For example, if we say that a given semiconductor device has a failure rate of 10 FIT, this means that one device fails for every component hours.
A.1 AQL Sampling Table
The Poisson distribution approximates the binomial probability distribution if the population is large and the phenomenon occurs with a low probability. It becomes the determining factor in the life of the device. Let us assume that the device will fail jiss the characteristic value changes to XL. Variance of normal distribution X0: If the sampled device is not returned non-replacementwe will have a hypergeometric distribution.
JIS Z – Test methods for flat pallets (FOREIGN STANDARD)
That is, it is a non-maintainable component. Such a system is known as a series system of redundancy of 0 figure B. R Lot acceptance rate 1.
How the lot acceptance rate changes is illustrated by the operation characteristic curve OC curve in figure B.
IX through IX, the Pascal and Gamma distributions are the discrete and continuous probability jie for the same probability model. This is based on equation IX This probability is described by the binomial probability distribution fBin x, n, p. The number of samples is determined according to the limits of the binomial distribution indexes.
If the number of defective devices x detected in a sample of n devices does not exceed c, the entire lot is considered to have passed R inspection. It is important to note that N no longer denotes the number of tests of Bernoulli trial due to the approximation of the binomial probability distribution to the Poisson distribution.
We can, however, make a generalization about the state function f X and the characteristic value X that defines the state. MTBF known after the life of equipment is of no practical use. Will not be passed. From one end of the wafer, each portion is inspected with a microscope. This occurs in the case of a surge pulse withstand or mechanical impact test.
The probability of defective items produced in the manufacturing process is p. The double exponential distribution is suitable for analysis of such kinds of phenomena. To serve as an example, consider the life L in equation IX The higher the temperature of the molecules, the higher becomes their energies, and so increasing the temperature quickens reactions.
If the original population is large, however, the fraction defective obtained through a sampling inspection can be approximated by the binomial distribution. Wear-outfailures which almost suddenly outbreak after a certain period approximate the normal distribution.
Shape palameter 2 Refer to Figure B.
A.1 AQL Sampling Table
By inspecting n randomly sampled devices, x defective devices are detected with the probability fH – geo N, R, n, x. This is analogous to the fact that the remaining life of an adult is not necessarily equal to the expected lifetime of a new born child minus the adult’s actual age.
Values in parentheses indicate the minimum quality required to have 19 out of 20 lots pass on average.
These functions are shown in figure B. Moreover, we consider the system in figure B. The fundamental condition of the Bernoulli trial is that results are only two types and they are definitely identified.
JIS Z 0602:1988
Number x pieces rejected. Different ways are available for sampling n devices from N devices. Let us assume that a given lot of semiconductor devices are storage tested at temperature T. When equipment can be repaired jie renewing a failed device, the mean value of the interval that operation is possible between occurrences of failures is know as the MTBF Mean Time Between Failures. The area of the wafer surface S is divided into many portions.
This is consistent with the fact that the geometric and exponential distributions are discrete and continuous his, respectively 0620 This process is explained in detail as follows. This model consists of m units connected in series, which i-th unit has ni devices connected in parallel. Therefore, the MTBF for a truncated portion of the life of the equipment up to the time T0 is estimated using the following expression: Expected characteristics of the function fNorm x are these: Each test result is independent from one another.
We cannot expect that there will be no collision for some time since one has just occurred. Math Statistics And Probability A. Scale palameter Refer to Figure Mis.
Let us first examine a simple binomial distribution model to know concretely what the normal distribution expresses. The Gamma distribution is a failure probability density function if failure occurrence is considered to follow the Poisson process. This is a parallel system with a redundancy of n -1 figure B. The lot is acccepted when failures are grater than Ac but less then Re. The level of degradation of the device can be expressed as a function of the leakage current i.